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Film formation technology Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

Film formation technology Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. FLOSFIA Kyoto//Electronic Components and Semiconductors
  2. AndTech Kanagawa//Service Industry
  3. ティー・ケイ・エス Tokyo//Electronic Components and Semiconductors
  4. 4 大和テクノシステムズ 本社 Tokyo//others
  5. 5 エツミ光学 大野工場 Fukui//Other manufacturing

Film formation technology Product ranking

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Introduction to FLOSFIA Inc.'s "Mist CVD Method Technology" FLOSFIA
  2. Film formation technology and equipment for various applications using high-speed sputtering. AndTech
  3. Ultrathin film formation technology - Atomic Layer Deposition ティー・ケイ・エス
  4. 4 Special film-forming technology "Osmium Coating" 大和テクノシステムズ 本社
  5. 4 Film formation technology "vacuum deposition" エツミ光学 大野工場

Film formation technology Product List

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Introduction to FLOSFIA Inc.'s "Mist CVD Method Technology"

Film-forming reaction technology particularly using "water" among liquids!

The "Mist CVD method" is a technology that uses a liquid "mist" that can be treated like a gas to perform a film-forming reaction (CVD). By using a mist-like raw material solution and a heating section, it is possible to produce oxide semiconductor thin films easily, inexpensively, and safely. This technology is suitable for forming many crystalline oxide films, and by applying it, it can be utilized in various applications and industrial fields such as solar cells, fuel cells, and organic devices. 【Features】 ■ Made from liquids, especially water ■ Raw materials can be supplied to the film-forming chamber in mist form ■ High safety of raw materials ■ No vacuum pump required ■ Large area, low cost, compact size, and high throughput are achievable *For more details, please refer to the catalog or feel free to contact us.

  • Other semiconductors
  • Other electronic parts

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Special film-forming technology "Osmium Coating"

Very smooth surface! Uniform special film-forming technology even on the inner walls.

By depositing osmium onto a high-precision processed and purified aperture plate, it is possible to prevent charge-up of the aperture plate. Osmium is a thin film with high hardness, high melting point, and good conductivity. Using the plasma CVD method for deposition allows for the formation of a uniform and smooth film even inside fine holes. 【Features】 ○ Film thickness: 50nm ○ Good conductivity ○ Excellent heat resistance For more details, please contact us or download the catalog.

  • others

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Film formation technology "vacuum deposition"

The high reliability of vacuum deposition technology and the diversity of optical products that arise from it.

Vacuum deposition is a film formation technology that involves heating the deposition material in a high vacuum to vaporize it. The vaporized material, now in gas form, collides with and adheres to a substrate, resulting in the formation of a deposited thin film. This principle is similar to when a plate is brought over steam that is boiling and evaporating, causing the evaporated water to adhere to the plate. By varying the combinations of refractive index, thickness, and number of layers of dielectric and metallic deposition materials, it is possible to control the transmission, reflection, and absorption of light (ultraviolet, visible, and infrared). 【Features】 ■ Capable of film formation on glass, plastic, film, metal, etc. ■ Deposition materials include metal oxides (ZrO2, Al2O3, TiO2, SiO2, etc.) and metals (Al, Cr, Ti, Sn, Au, Ag, etc.) ■ Use of continuous vacuum deposition equipment enhances quality and productivity ■ Film formation in high vacuum improves the adhesion and quality of the deposited film *For more details, please download the PDF or feel free to contact us.

  • others

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Electrostatic spray coating technology

Compatible with insulating substrates! High-quality electrostatic spray applies liquid materials such as nano-dispersions onto the workpiece.

We would like to introduce Hamamatsu Nanotechnology Co., Ltd.'s "Electrostatic Spray Coating Technology." This technology involves atomizing liquid materials, such as nano-dispersed liquids, into fine droplets using high voltage and spraying them onto a substrate surface to form a layered film. It can accommodate customization for film formation range, quantitative pumps, hot plates, and more. Additionally, it features a wide range of compatibility for thin coatings. 【Features】 ■ High-quality electrostatic spraying that excels in fine droplet formation ■ Dispersion coating on substrates that brings out the functions of nano materials ■ Film formation of fine filling structures and porous structures made from nano materials ■ Film formation is possible even on insulating substrates ■ Sample preparation suitable for observing individual nano materials (for electron microscopy and atomic force microscopy) *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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Ultrathin film formation technology - Atomic Layer Deposition

Designed for R&D activities and industrial-scale mass production! We provide custom-made reactor tools.

Atomic Layer Deposition (ALD) is a special coating method within CVD. The complementary and self-limiting surface reactions in the ALD process provide uniform films with controlled thickness down to the nanometer scale and excellent step coverage on complex 3D surface geometries. For ALD processing, FHR Anlagenbau GmbH offers custom-made reactor tools designed for R&D activities and mass production on an industrial scale. [Coating Method] ■ Performed by alternating substrate exposure to at least two chemical reactants (precursors) ■ The first precursor is flashed onto the substrate ■ The precursor reacts with reactive surface sites until there are no unreacted surface sites left (saturation) ■ The gaseous reaction byproducts of the first precursor are purged with inert gas ■ The second precursor is flashed, and surface reactions occur again until saturation is reached ■ After purging the reaction, in the case of residuals from the second precursor, the cycle is resumed by flashing the first precursor *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Film formation technology and equipment for various applications using high-speed sputtering.

New members who apply for the first time by September 3 will receive an early bird discount price of 42,000 yen.

【Speaker】 Mr. Yoshiyuki Kadokura, Director of the Sixth Research Department, Semiconductor Electronics Research Institute, ULVAC, Inc. Mr. Hiroyasu Kojima, Representative Director of Earth Tech, Visiting Associate Professor at Nagoya University 【Venue】 Comprehensive Community Center, 3rd Floor, Conference Room 1, Kawasaki City, Kanagawa 【Date and Time】 September 14, 2010 (Tuesday) 13:00 - 16:15

  • Vacuum forming machine
  • Technical Seminar
  • Organic EL

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